Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC857CQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC857CQB-QSOT8015DFN1110D-31.602255 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662722147312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.332032
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.045742
Phenolic resinProprietary0.00094713.5300000.059110
subTotal0.007000100.0000000.436884
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000001.872361
subTotal0.030000100.0000001.872361
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600044.862192
Magnesium (Mg)7439-95-40.0011200.1490000.069931
Nickel (Ni)7440-02-00.0224162.9809001.399051
Silicon (Si)7440-21-30.0048570.6459000.303146
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003614
Nickel (Ni)7440-02-00.0044670.5940000.278787
Palladium (Pd)7440-05-30.0002740.0365000.017131
subTotal0.752000100.00000046.933853
Mould CompoundFillerSilica -amorphous-7631-86-90.0600107.9800003.745321
Silica fused60676-86-00.60229280.09200037.590261
PigmentCarbon black1333-86-40.0069790.9280000.435546
PolymerEpoxy resin systemProprietary0.0635448.4500003.965911
Phenolic resinProprietary0.0191762.5500001.196813
subTotal0.752000100.00000046.933853
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000160
Non hazardousProprietary0.0000320.0555000.001974
Tin solderTin (Sn)7440-31-50.05696699.9400003.555352
subTotal0.057000100.0000003.557486
WireImpurityNon hazardousProprietary0.0000000.0100000.000027
Pure metalCopper (Cu)7440-50-80.00425599.9900000.265537
subTotal0.004255100.0000000.265563
total1.602255100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.