Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BCX52-10T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BCX52-10TSOT89MPT340.314676 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346613291351126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08470077.0000000.210097
PolymerResin systemProprietary0.02530023.0000000.062756
subTotal0.110000100.0000000.272853
DieDoped siliconSilicon (Si)7440-21-30.117000100.0000000.290217
subTotal0.117000100.0000000.290217
Lead FrameCopper alloyCopper (Cu)7440-50-817.12911299.82000042.488527
Iron (Fe)7439-89-60.0171600.1000000.042565
Phosphorus (P)7723-14-00.0051480.0300000.012770
Pure metal layerSilver (Ag)7440-22-40.0085800.0500000.021283
subTotal17.160000100.00000042.565144
Mould CompoundAdditiveNon hazardousProprietary0.6614902.9000001.640817
Triphenylphosphine603-35-00.0114050.0500000.028290
FillerSilica -amorphous-7631-86-916.42320072.00000040.737522
PigmentCarbon black1333-86-40.0114050.0500000.028290
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.42150015.0000008.486984
Phenol Formaldehyde resin (generic)9003-35-42.28100010.0000005.657989
subTotal22.810000100.00000056.579892
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000008
Non hazardousProprietary0.0000390.0555000.000096
Tin solderTin (Sn)7440-31-50.06995899.9400000.173530
subTotal0.070000100.0000000.173634
WireImpurityNon hazardousProprietary0.0000050.0100000.000012
Pure metalGold (Au)7440-57-50.04767199.9900000.118247
subTotal0.047676100.0000000.118259
total40.314676100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.