Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSS138BKW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSS138BKWSOT323SC-705.667215 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340657311156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.0012702.5400000.022410
Doped siliconSilicon (Si)7440-21-30.04551591.0300000.803128
Gold alloyGold (Au)7440-57-50.0032156.4300000.056730
subTotal0.050000100.0000000.882268
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018290.0900000.032270
Carbon (C)7440-44-00.0008130.0400000.014342
Chromium (Cr)7440-47-30.0042670.2100000.075296
Cobalt (Co)7440-48-40.0085340.4200000.150592
Iron (Fe)7439-89-60.95829147.16000016.909385
Manganese (Mn)7439-96-50.0172720.8500000.304771
Nickel (Ni)7440-02-00.72176635.52000012.735822
Phosphorus (P)7723-14-00.0004060.0200000.007171
Silicon (Si)7440-21-30.0050800.2500000.089638
Sulphur (S)7704-34-90.0004060.0200000.007171
Pure metal layerCopper (Cu)7440-50-80.26497313.0400004.675538
Silver (Ag)7440-22-40.0483622.3800000.853357
subTotal2.032000100.00000035.855354
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.724480
Triphenylphosphine603-35-00.0016850.0500000.029732
FillerSilica -amorphous-7631-86-92.42640072.00000042.814681
PigmentCarbon black1333-86-40.0016850.0500000.029732
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000008.919725
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000005.946483
subTotal3.370000100.00000059.464834
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000111
Bismuth (Bi)7440-69-90.0000020.0010000.000037
Copper (Cu)7440-50-80.0000020.0010000.000037
Lead (Pb)7439-92-10.0000100.0050000.000185
Tin solderTin (Sn)7440-31-50.20997999.9900003.705153
subTotal0.210000100.0000003.705524
WirePure metalCopper (Cu)7440-50-80.005215100.0000000.092021
subTotal0.005215100.0000000.092021
total5.667215100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.