Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK6D120-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK6D120-40ESOT1220DFN2020MD-67.007640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346607441152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.799128
PolymerAcrylic resinProprietary0.01400020.0000000.199782
subTotal0.070000100.0000000.998910
DieDoped siliconSilicon (Si)7440-21-30.140000100.0000001.997820
subTotal0.140000100.0000001.997820
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560038.599483
Magnesium (Mg)7439-95-40.0042170.1459000.060170
Nickel (Ni)7440-02-00.0843532.9188001.203734
Silicon (Si)7440-21-30.0182760.6324000.260806
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013733
Nickel (Ni)7440-02-00.0740132.5610001.056174
Palladium (Pd)7440-05-30.0032660.1130000.046602
subTotal2.890000100.00000041.240703
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000012.242353
Silica fused60676-86-02.23800060.00000031.936572
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.596829
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.266138
PigmentCarbon black1333-86-40.0186500.5000000.266138
PolymerEpoxy resin systemProprietary0.2611007.0000003.725933
Phenolic resinProprietary0.2238006.0000003.193657
subTotal3.730000100.00000053.227620
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0000940.0555000.001346
Tin solderTin (Sn)7440-31-50.16989899.9400002.424468
subTotal0.170000100.0000002.425924
WireImpurityNon hazardousProprietary0.0000010.0100000.000011
Pure metalCopper (Cu)7440-50-80.00763999.9900000.109013
subTotal0.007640100.0000000.109024
total7.007640100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.