Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7D36-60E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7D36-60ESOT1220DFN2020MD-67.447543 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346617251151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.751926
PolymerAcrylic resinProprietary0.01400020.0000000.187981
subTotal0.070000100.0000000.939907
DieDoped siliconSilicon (Si)7440-21-30.570000100.0000007.653531
subTotal0.570000100.0000007.653531
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560036.319533
Magnesium (Mg)7439-95-40.0042170.1459000.056616
Nickel (Ni)7440-02-00.0843532.9188001.132633
Silicon (Si)7440-21-30.0182760.6324000.245401
Pure metal layerGold (Au)7440-57-50.0009620.0333000.012922
Nickel (Ni)7440-02-00.0740132.5610000.993789
Palladium (Pd)7440-05-30.0032660.1130000.043849
subTotal2.890000100.00000038.804744
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.519235
Silica fused60676-86-02.23800060.00000030.050179
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.502509
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.250418
PigmentCarbon black1333-86-40.0186500.5000000.250418
PolymerEpoxy resin systemProprietary0.2611007.0000003.505854
Phenolic resinProprietary0.2238006.0000003.005018
subTotal3.730000100.00000050.083632
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000103
Non hazardousProprietary0.0000940.0555000.001267
Tin solderTin (Sn)7440-31-50.16989899.9400002.281262
subTotal0.170000100.0000002.282632
WireImpurityNon hazardousProprietary0.0000020.0100000.000024
Pure metalCopper (Cu)7440-50-80.01754199.9900000.235524
subTotal0.017542100.0000000.235547
total7.447543100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.