Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7S0R5-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7S0R5-40HSOT1235LFPAK88355.814000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346613151184126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.500000100.0000000.983660
subTotal3.500000100.0000000.983660
ClipCopper alloyCopper (Cu)7440-50-860.20958899.86000016.921647
Iron (Fe)7439-89-60.0663230.1100000.018640
Phosphorus (P)7723-14-00.0180880.0300000.005084
subTotal60.294000100.00000016.945370
Lead FrameCopper alloyCopper (Cu)7440-50-8172.92756299.86000048.600550
Iron (Fe)7439-89-60.2251210.1300000.063269
Phosphorus (P)7723-14-00.0519510.0300000.014601
subTotal173.170000100.00000048.678420
Mould CompoundFillerSilica fused60676-86-063.33300062.00000017.799468
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.83325015.5000004.449867
ImpuritySilicon Dioxide (SiO2)14808-60-70.2043000.2000000.057418
PigmentCarbon black1333-86-40.5107500.5000000.143544
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.0430002.0000000.574176
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.23650011.0000003.157970
Phenolic resinProprietary8.9892008.8000002.526376
subTotal102.150000100.00000028.708820
Post-PlatingImpurityNon hazardousProprietary0.0004880.0100000.000137
Tin alloyTin (Sn)7440-31-54.87951299.9900001.371366
subTotal4.880000100.0000001.371503
Solder PasteImpurityAntimony (Sb)7440-36-00.0024810.0300000.000697
Lead alloyLead (Pb)7439-92-17.64726992.4700002.149232
Silver (Ag)7440-22-40.2067502.5000000.058106
Tin (Sn)7440-31-50.4135005.0000000.116212
subTotal8.270000100.0000002.324248
Solder PasteImpurityAntimony (Sb)7440-36-00.0012420.0350000.000349
Lead alloyLead (Pb)7439-92-13.28250892.4650000.922535
Silver (Ag)7440-22-40.0887502.5000000.024943
Tin (Sn)7440-31-50.1775005.0000000.049886
subTotal3.550000100.0000000.997712
total355.814000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.