Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7S1R0-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7S1R0-40HSOT1235LFPAK88346.070000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346605611184126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.900000100.0000000.549022
subTotal1.900000100.0000000.549022
ClipCopper alloyCopper (Cu)7440-50-847.13392099.86000013.619765
Iron (Fe)7439-89-60.0519200.1100000.015003
Phosphorus (P)7723-14-00.0141600.0300000.004092
subTotal47.200000100.00000013.638859
Lead FrameCopper alloyCopper (Cu)7440-50-8172.92756299.86000049.968955
Iron (Fe)7439-89-60.2251210.1300000.065051
Phosphorus (P)7723-14-00.0519510.0300000.015012
subTotal173.170000100.00000050.049017
Mould CompoundFillerSilica fused60676-86-063.33300062.00000018.300633
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.83325015.5000004.575158
ImpuritySilicon Dioxide (SiO2)14808-60-70.2043000.2000000.059034
PigmentCarbon black1333-86-40.5107500.5000000.147586
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.0430002.0000000.590343
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.23650011.0000003.246886
Phenolic resinProprietary8.9892008.8000002.597509
subTotal102.150000100.00000029.517150
Post-PlatingImpurityNon hazardousProprietary0.0004880.0100000.000141
Tin alloyTin (Sn)7440-31-54.87951299.9900001.409978
subTotal4.880000100.0000001.410119
Solder PasteImpurityAntimony (Sb)7440-36-00.0035460.0300000.001025
Lead alloyLead (Pb)7439-92-110.92995492.4700003.158307
Silver (Ag)7440-22-40.2955002.5000000.085387
Tin (Sn)7440-31-50.5910005.0000000.170775
subTotal11.820000100.0000003.415494
Solder PasteImpurityAntimony (Sb)7440-36-00.0017320.0350000.000501
Lead alloyLead (Pb)7439-92-14.57701892.4650001.322570
Silver (Ag)7440-22-40.1237502.5000000.035759
Tin (Sn)7440-31-50.2475005.0000000.071517
subTotal4.950000100.0000001.430346
total346.070000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.