Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M24-60E/C4

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M24-60E/C4SOT1210mLFPAK37.458015 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346621421150126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.038015100.0000002.771143
subTotal1.038015100.0000002.771143
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000015.186603
Iron (Fe)7439-89-60.0085500.1500000.022826
Phosphorus (P)7723-14-00.0028500.0500000.007609
subTotal5.700000100.00000015.217037
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000037.033997
Iron (Fe)7439-89-60.0208500.1500000.055662
Phosphorus (P)7723-14-00.0069500.0500000.018554
subTotal13.900000100.00000037.108213
Mould CompoundFillerSilica fused60676-86-05.28860062.00000014.118741
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.529685
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.045544
PigmentCarbon black1333-86-40.0426500.5000000.113861
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.455443
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.504938
Phenolic resinProprietary0.7506408.8000002.003950
subTotal8.530000100.00000022.772162
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001028
Tin alloyTin (Sn)7440-31-53.84961599.99000010.277146
subTotal3.850000100.00000010.278174
Solder PasteLead alloyLead (Pb)7439-92-14.10700092.50000010.964276
Silver (Ag)7440-22-40.1110002.5000000.296332
Tin (Sn)7440-31-50.2220005.0000000.592664
subTotal4.440000100.00000011.853271
total37.458015100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.