Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M6R7-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M6R7-40HSOT1210mLFPAK37.420000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346607951152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.000000100.0000002.672368
subTotal1.000000100.0000002.672368
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000015.202031
Iron (Fe)7439-89-60.0085500.1500000.022849
Phosphorus (P)7723-14-00.0028500.0500000.007616
subTotal5.700000100.00000015.232496
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000037.071619
Iron (Fe)7439-89-60.0208500.1500000.055719
Phosphorus (P)7723-14-00.0069500.0500000.018573
subTotal13.900000100.00000037.145911
Mould CompoundFillerSilica fused60676-86-05.28860062.00000014.133084
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.533271
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.045591
PigmentCarbon black1333-86-40.0426500.5000000.113976
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.455906
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.507483
Phenolic resinProprietary0.7506408.8000002.005986
subTotal8.530000100.00000022.795297
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001029
Tin alloyTin (Sn)7440-31-53.84961599.99000010.287587
subTotal3.850000100.00000010.288616
Solder PasteLead alloyLead (Pb)7439-92-14.10700092.50000010.975414
Silver (Ag)7440-22-40.1110002.5000000.296633
Tin (Sn)7440-31-50.2220005.0000000.593266
subTotal4.440000100.00000011.865313
total37.420000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.