Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZB984-C6V8

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZB984-C6V8SOT663SOT32.524880 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405672411512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000003.960584
subTotal0.100000100.0000003.960584
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0007600.0800000.030100
Carbon (C)7440-44-00.0003800.0400000.015050
Chromium (Cr)7440-47-30.0019950.2100000.079014
Cobalt (Co)7440-48-40.0039900.4200000.158027
Iron (Fe)7439-89-60.44384046.72000017.578657
Manganese (Mn)7439-96-50.0079800.8400000.316055
Nickel (Ni)7440-02-00.33440035.20000013.244194
Phosphorus (P)7723-14-00.0001900.0200000.007525
Silicon (Si)7440-21-30.0023750.2500000.094064
Sulphur (S)7704-34-90.0001900.0200000.007525
Pure metal layerCopper (Cu)7440-50-80.12274012.9200004.861221
Silver (Ag)7440-22-40.0311603.2800001.234118
subTotal0.950000100.00000037.625551
Mould CompoundFillerSilica fused60676-86-01.00820071.00000039.930611
PigmentCarbon black1333-86-40.0042600.3000000.168721
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.27974019.70000011.079338
Phenolic resinProprietary0.1278009.0000005.061627
subTotal1.420000100.00000056.240297
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000010.0030000.000052
Bismuth (Bi)7440-69-90.0000000.0010000.000017
Copper (Cu)7440-50-80.0000000.0010000.000017
Lead (Pb)7439-92-10.0000020.0050000.000087
Tin solderTin (Sn)7440-31-50.04399699.9900001.742483
subTotal0.044000100.0000001.742657
WireImpurityNon hazardousProprietary0.0000010.0100000.000043
Pure metalGold (Au)7440-57-50.01087999.9900000.430868
subTotal0.010880100.0000000.430912
total2.524880100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.