Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX884S-C24

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX884S-C24SOD882BDXSON20.91148 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346619523152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.58424
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0019910.470000.21825
Phenolic resinProprietary0.0025713.530000.28204
subTotal0.01900100.000002.08453
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.48558
subTotal0.05000100.000005.48558
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.42932
Magnesium (Mg)7439-95-40.000590.150000.06500
Nickel (Ni) - cas no. 7440-02-07440-02-00.011772.980001.29142
Silicon (Si)7440-21-30.002570.650000.28168
Pure metal layerGold (Au)7440-57-50.000040.010000.00433
Nickel (Ni) - cas no. 7440-02-07440-02-00.002250.570000.24702
Palladium (Pd)7440-05-30.000160.040000.01733
subTotal0.39500100.0000043.33610
Mould CompoundFillerSilica -amorphous-7631-86-90.029617.000003.24856
Silica fused60676-86-00.3510983.0000038.51867
PigmentCarbon black1333-86-40.002120.500000.23204
PolymerEpoxy resin systemProprietary0.025386.000002.78448
Phenolic resinProprietary0.014803.500001.62428
subTotal0.42300100.0000046.40803
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.010000.00022
Bismuth (Bi)7440-69-90.000000.020000.00044
Iron (Fe)7439-89-60.000000.010000.00022
Lead (Pb)7439-92-10.000000.010000.00022
Tin solderTin (Sn)7440-31-50.0199999.950002.19314
subTotal0.02000100.000002.19424
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49146
subTotal0.00448100.000000.49151
total0.91148100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.