Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-C1V8

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-C1V8SOD882BDXSON20.88997 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346620913151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.62253
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0019910.470000.22352
Phenolic resinProprietary0.0025713.530000.28885
subTotal0.01900100.000002.13490
DieDoped siliconSilicon (Si)7440-21-30.02841100.000003.19260
subTotal0.02841100.000003.19260
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.43064
Magnesium (Mg)7439-95-40.000590.150000.06658
Nickel (Ni) - cas no. 7440-02-07440-02-00.011772.980001.32263
Silicon (Si)7440-21-30.002570.650000.28849
Pure metal layerGold (Au)7440-57-50.000040.010000.00444
Nickel (Ni) - cas no. 7440-02-07440-02-00.002250.570000.25299
Palladium (Pd)7440-05-30.000160.040000.01775
subTotal0.39500100.0000044.38352
Mould CompoundFillerSilica -amorphous-7631-86-90.029617.000003.32708
Silica fused60676-86-00.3510983.0000039.44964
PigmentCarbon black1333-86-40.002120.500000.23765
PolymerEpoxy resin systemProprietary0.025386.000002.85178
Phenolic resinProprietary0.014803.500001.66354
subTotal0.42300100.0000047.52969
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.010000.00022
Bismuth (Bi)7440-69-90.000000.020000.00045
Iron (Fe)7439-89-60.000000.010000.00022
Lead (Pb)7439-92-10.000000.010000.00022
Tin solderTin (Sn)7440-31-50.0199999.950002.24614
subTotal0.02000100.000002.24725
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045699.990000.51233
subTotal0.00456100.000000.51238
total0.88997100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.