Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBZ33VBQC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ33VBQC-QSOT8009DFN1412D-32.474480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666837147212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00456076.0000000.184281
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00062810.4700000.025387
Phenolic resinProprietary0.00081213.5300000.032807
subTotal0.006000100.0000000.242475
DieDoped siliconSilicon (Si)7440-21-30.049000100.0000001.980214
subTotal0.049000100.0000001.980214
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920044.029495
Magnesium (Mg)7439-95-40.0016980.1454000.068631
Nickel (Ni)7440-02-00.0339762.9089001.373054
Silicon (Si)7440-21-30.0073620.6303000.297513
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017606
Nickel (Ni)7440-02-00.0335472.8722001.355731
Palladium (Pd)7440-05-30.0014800.1267000.059805
subTotal1.168000100.00000047.201836
Mould CompoundAdditiveNon hazardousProprietary0.0047400.4100000.191539
FillerSilica -amorphous-7631-86-90.0033520.2900000.135479
Silica fused60676-86-00.99589486.15000040.246597
HardenerPhenolic resinProprietary0.0495924.2900002.004154
PigmentCarbon black1333-86-40.0021960.1900000.088762
PolymerEpoxy resin systemProprietary0.1002258.6700004.050354
subTotal1.156000100.00000046.716886
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000151
Non hazardousProprietary0.0000460.0555000.001862
Tin solderTin (Sn)7440-31-50.08295099.9400003.352228
subTotal0.083000100.0000003.354240
WireImpurityNon hazardousProprietary0.0000010.0100000.000050
Pure metalGold (Au)7440-57-50.01247999.9900000.504298
subTotal0.012480100.0000000.504348
total2.474480100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.