Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NCR321PAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NCR321PASSOT1118DHUSON67.002160 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346613911153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.891154
PolymerAcrylic resinProprietary0.01560020.0000000.222788
subTotal0.078000100.0000001.113942
DieDoped siliconSilicon (Si)7440-21-30.147000100.0000002.099352
subTotal0.147000100.0000002.099352
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000036.551723
Magnesium (Mg)7439-95-40.0053820.2000000.076862
Nickel (Ni)7440-02-00.0853053.1700001.218263
Silicon (Si)7440-21-30.0185680.6900000.265174
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007686
Nickel (Ni)7440-02-00.0199130.7400000.284389
Palladium (Pd)7440-05-30.0018840.0700000.026902
subTotal2.691000100.00000038.430998
Mould CompoundFillerSilica -amorphous-7631-86-90.89424023.00000012.770916
Silica fused60676-86-02.33280060.00000033.315434
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1166403.0000001.665772
Ion trapping agentBismuth (Bi)7440-69-90.0194400.5000000.277629
PigmentCarbon black1333-86-40.0194400.5000000.277629
PolymerEpoxy resin systemProprietary0.2721607.0000003.886801
Phenolic resinProprietary0.2332806.0000003.331543
subTotal3.888000100.00000055.525723
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000105
Non hazardousProprietary0.0000910.0555000.001300
Tin solderTin (Sn)7440-31-50.16390299.9400002.340729
subTotal0.164000100.0000002.342134
WireImpurityNon hazardousProprietary0.0000030.0100000.000049
Pure metalGold (Au)7440-57-50.03415799.9900000.487801
subTotal0.034160100.0000000.487849
total7.002160100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.