Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NMUX1309BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NMUX1309BQ-Q100SOT763-1DHVQFN1621.301714 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356914161154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004679
FillerSilver (Ag)7440-22-40.07476075.0000000.350958
PolymerAcrylic resinProprietary0.0059816.0000000.028077
Resin systemProprietary0.01794218.0000000.084230
subTotal0.099680100.0000000.467944
DieDoped siliconSilicon (Si)7440-21-30.243112100.0000001.141280
subTotal0.243112100.0000001.141280
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04341097.47000037.759448
Iron (Fe)7439-89-60.1980532.4000000.929749
Phosphorus (P)7723-14-00.0024760.0300000.011622
Zinc (Zn)7440-66-60.0082520.1000000.038740
subTotal8.252190100.00000038.739559
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.742414
FillerSilica -amorphous-7631-86-90.4341033.4900002.037876
Silica fused60676-86-010.55031084.82000049.527988
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.585087
PigmentCarbon black1333-86-40.0203990.1640000.095763
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.161083
Epoxy resin systemProprietary0.1972741.5860000.926095
Phenolic resinProprietary0.2802392.2530001.315569
subTotal12.438470100.00000058.391874
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009834
Nickel (Ni)7440-02-00.19063691.0000000.894932
Palladium (Pd)7440-05-30.0167598.0000000.078675
subTotal0.209490100.0000000.983442
WirePure metalCopper (Cu)7440-50-80.05674496.5500000.266384
Pure metal layerGold (Au)7440-57-50.0002060.3500000.000966
Palladium (Pd)7440-05-30.0018223.1000000.008553
subTotal0.058772100.0000000.275903
total21.301714100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.