Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NSF080120D7A0

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NSF080120D7A0SOT8070-1TO263-7L1504.414758 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346673911183126030 s123520 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped silicon carbideSilicon Carbide (SiC)409-21-22.240000100.0000000.148895
subTotal2.240000100.0000000.148895
subTotal0.000010100.0000000.000000
Lead FrameCopper alloyCopper (Cu)7440-50-8859.78512999.85890057.150804
Iron (Fe)7439-89-60.7068810.0821000.046987
Phosphorus (P)7723-14-00.2238600.0260000.014880
Nickel alloyNickel (Ni)7440-02-00.0861000.0100000.005723
Phosphorus (P)7723-14-00.1205400.0140000.008012
Pure metal layerNickel (Ni)7440-02-00.0774900.0090000.005151
subTotal861.000000100.00000057.231558
Mould CompoundFillerSilica -amorphous-7631-86-992.18850015.0000006.127865
Silica fused60676-86-0460.94250075.00000030.639323
PigmentCarbon black1333-86-43.0729500.5000000.204262
PolymerEpoxy resin systemProprietary46.0942507.5000003.063932
Phenolic resinProprietary12.2918002.0000000.817049
subTotal614.590000100.00000040.852431
Post-PlatingImpurityNon hazardousProprietary0.0014300.0100000.000095
Tin solderTin (Sn)7440-31-514.29857099.9900000.950441
subTotal14.300000100.0000000.950536
Solder WireLead alloyLead (Pb)7439-92-15.32950093.5000000.354257
Silver (Ag)7440-22-40.0855001.5000000.005683
Tin (Sn)7440-31-50.2850005.0000000.018944
subTotal5.700000100.0000000.378885
WireImpurityCopper (Cu)7440-50-80.0000030.0010000.000000
Iron (Fe)7439-89-60.0000030.0010000.000000
Magnesium (Mg)7439-95-40.0000030.0010000.000000
Nickel (Ni)7440-02-00.0000180.0060000.000001
Silicon (Si)7440-21-30.0000030.0010000.000000
Pure metalAluminium (Al)7429-90-50.29415099.9900000.019552
subTotal0.294180100.0000000.019554
WireImpurityCopper (Cu)7440-50-80.0000630.0010000.000004
Iron (Fe)7439-89-60.0000630.0010000.000004
Magnesium (Mg)7439-95-40.0000630.0010000.000004
Nickel (Ni)7440-02-00.0003770.0060000.000025
Silicon (Si)7440-21-30.0000630.0010000.000004
Pure metalAluminium (Al)7429-90-56.28994099.9900000.418099
subTotal6.290569100.0000000.418141
total1504.414758100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.