Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NX3008PBKMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NX3008PBKMBSOT883BXQFN30.69002 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340658653158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33043
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0003110.470000.04552
Phenolic resinProprietary0.0004113.530000.05882
subTotal0.00300100.000000.43477
DieAluminium alloyAluminium (Al)7429-90-50.002576.430000.37274
Doped siliconSilicon (Si)7440-21-30.0364191.030005.27695
Gold alloyGold (Au)7440-57-50.001022.540000.14724
subTotal0.04000100.000005.79693
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09739
Copper (Cu)7440-50-80.2632094.0000038.14382
Tin (Sn)7440-31-50.000670.240000.09739
Zinc (Zn)7440-66-60.000590.210000.08521
Pure metal layerGold (Au)7440-57-50.000220.080000.03246
Nickel (Ni) - cas no. 7440-02-07440-02-00.013834.940002.00458
Palladium (Pd)7440-05-30.000810.290000.11768
subTotal0.28000100.0000040.57853
Mould CompoundFillerSilica -amorphous-7631-86-90.0680020.000009.85479
Silica fused60676-86-00.2193064.5000031.78169
Flame retardantMetal hydroxideProprietary0.010203.000001.47822
ImpuritySilicon Dioxide (SiO2)14808-60-70.001700.500000.24637
PigmentCarbon black1333-86-40.001020.300000.14782
PolymerPhenol Formaldehyde resin (generic)9003-35-40.007482.200001.08403
Phenolic resinProprietary0.008502.500001.23185
Tetramethylbiphenyl diglycidyl ether85954-11-60.023807.000003.44918
subTotal0.34000100.0000049.27395
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.010000.00029
Bismuth (Bi)7440-69-90.000000.020000.00058
Iron (Fe)7439-89-60.000000.010000.00029
Lead (Pb)7439-92-10.000000.010000.00029
Tin solderTin (Sn)7440-31-50.0199999.950002.89702
subTotal0.02000100.000002.89847
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0070199.990001.01654
subTotal0.00701100.000001.01664
total0.69002100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.