Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXB0101GS-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0101GS-Q100SOT1202X2SON61.020821 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915151254126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.082276100.0000008.059767
subTotal0.082276100.0000008.059767
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.024490
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.024490
Silica -amorphous-7631-86-90.00250050.0000000.244901
PolymerEpoxy resin systemProprietary0.00150030.0000000.146941
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.048980
subTotal0.005000100.0000000.489802
Lead FrameCopper alloyCopper (Cu)7440-50-80.39788794.51000038.977166
Magnesium (Mg)7439-95-40.0006320.1500000.061862
Nickel (Ni)7440-02-00.0124202.9500001.216619
Silicon (Si)7440-21-30.0026940.6400000.263944
Pure metal layerGold (Au)7440-57-50.0000840.0200000.008248
Nickel (Ni)7440-02-00.0069041.6400000.676358
Palladium (Pd)7440-05-30.0003790.0900000.037117
subTotal0.421000100.00000041.241315
Mould CompoundAdditiveNon hazardousProprietary0.0020130.4100000.197204
FillerSilica -amorphous-7631-86-90.0014240.2900000.139486
Silica fused60676-86-00.42299686.15000041.436892
HardenerPhenolic resinProprietary0.0210644.2900002.063427
PigmentCarbon black1333-86-40.0009330.1900000.091387
PolymerEpoxy resin systemProprietary0.0425708.6700004.170143
subTotal0.491000100.00000048.098540
WireGold alloyGold (Au)7440-57-50.02133099.0000002.089451
Palladium (Pd)7440-05-30.0002151.0000000.021106
subTotal0.021545100.0000002.110556
total1.020821100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.