Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXB0101GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0101GW-Q100SOT363-2SC-885.860662 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356913271255126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.219402100.0000003.743641
subTotal0.219402100.0000003.743641
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.004266
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.004266
Silica -amorphous-7631-86-90.00250050.0000000.042657
PolymerEpoxy resin systemProprietary0.00150030.0000000.025594
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.008531
subTotal0.005000100.0000000.085315
Lead FrameCopper alloyCopper (Cu)7440-50-82.04332496.84000034.865072
Iron (Fe)7439-89-60.0487412.3100000.831664
Lead (Pb)7439-92-10.0002110.0100000.003600
Phosphorus (P)7723-14-00.0014770.0700000.025202
Zinc (Zn)7440-66-60.0025320.1200000.043203
Pure metal layerSilver (Ag)7440-22-40.0137150.6500000.234018
subTotal2.110000100.00000036.002759
Mould CompoundFillerSilica -amorphous-7631-86-90.43960014.0000007.500859
Silica fused60676-86-02.21589870.57000037.809688
PigmentCarbon black1333-86-40.0062800.2000000.107155
PolymerEpoxy resin systemProprietary0.2917069.2900004.977356
Phenolic resinProprietary0.1865165.9400003.182507
subTotal3.140000100.00000053.577565
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000189
Bismuth (Bi)7440-69-90.0000040.0010000.000063
Copper (Cu)7440-50-80.0000040.0010000.000063
Lead (Pb)7439-92-10.0000180.0050000.000316
Tin solderTin (Sn)7440-31-50.36996399.9900006.312649
subTotal0.370000100.0000006.313280
WireImpurityNon hazardousProprietary0.0000020.0100000.000028
Pure metalCopper (Cu)7440-50-80.01625899.9900000.277408
subTotal0.016260100.0000000.277436
total5.860662100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.