Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXB0106BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0106BQ-Q100SOT763-1DHVQFN1622.138335 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915301153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.135512
ImpurityNon hazardousProprietary0.0000200.0395000.000089
PolymerResin systemProprietary0.01997639.9514100.090231
subTotal0.050000100.0000000.225832
DieDoped siliconSilicon (Si)7440-21-31.136616100.0000005.134153
subTotal1.136616100.0000005.134153
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.333244
Iron (Fe)7439-89-60.1980572.4000000.894632
Phosphorus (P)7723-14-00.0024760.0300000.011183
Zinc (Zn)7440-66-60.0082520.1000000.037276
subTotal8.252360100.00000037.276335
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.676565
FillerSilica -amorphous-7631-86-90.4341023.4900001.960862
Silica fused60676-86-010.55030284.82000047.656257
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.562975
PigmentCarbon black1333-86-40.0203990.1640000.092144
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.079413
Epoxy resin systemProprietary0.1972741.5860000.891097
Phenolic resinProprietary0.2802392.2530001.265852
subTotal12.438460100.00000056.185165
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009462
Nickel (Ni)7440-02-00.19062791.0000000.861071
Palladium (Pd)7440-05-30.0167588.0000000.075699
subTotal0.209480100.0000000.946232
WirePure metalCopper (Cu)7440-50-80.04964596.5500000.224250
Pure metal layerGold (Au)7440-57-50.0001800.3500000.000813
Palladium (Pd)7440-05-30.0015943.1000000.007200
subTotal0.051419100.0000000.232263
total22.138335100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.