Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBHV8215Z

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBHV8215ZSOT223SC-73103.383624 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340634791158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10010077.0000000.096824
PolymerResin systemProprietary0.02990023.0000000.028921
subTotal0.130000100.0000000.125745
DieDoped siliconSilicon (Si)7440-21-31.050000100.0000001.015635
subTotal1.050000100.0000001.015635
Lead FrameCopper alloyCopper (Cu)7440-50-850.72514099.15000049.064966
Iron (Fe)7439-89-60.0511600.1000000.049486
Phosphorus (P)7723-14-00.0153480.0300000.014846
Pure metal layerSilver (Ag)7440-22-40.3683520.7200000.356296
subTotal51.160000100.00000049.485594
Mould CompoundAdditiveNon hazardousProprietary1.4149102.9000001.368602
Triphenylphosphine603-35-00.0243950.0500000.023597
FillerSilica -amorphous-7631-86-935.12880072.00000033.979076
PigmentCarbon black1333-86-40.0243950.0500000.023597
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.31850015.0000007.078974
Phenol Formaldehyde resin (generic)9003-35-44.87900010.0000004.719316
subTotal48.790000100.00000047.193161
Post-PlatingImpurityLead (Pb)7439-92-10.0000990.0045000.000096
Non hazardousProprietary0.0012270.0555000.001186
Tin solderTin (Sn)7440-31-52.20867499.9400002.136387
subTotal2.210000100.0000002.137669
WireImpurityNon hazardousProprietary0.0000040.0100000.000004
Pure metalCopper (Cu)7440-50-80.04362099.9900000.042192
subTotal0.043624100.0000000.042197
total103.383624100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.