Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSM5240PFH

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSM5240PFHSOT1118HUSON67.022688 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340665621156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.888549
PolymerAcrylic resinProprietary0.01560020.0000000.222137
subTotal0.078000100.0000001.110686
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.711978
subTotal0.050000100.0000000.711978
DieDoped siliconSilicon (Si)7440-21-30.120000100.0000001.708747
subTotal0.120000100.0000001.708747
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000036.444878
Magnesium (Mg)7439-95-40.0053820.2000000.076637
Nickel (Ni)7440-02-00.0853053.1700001.214702
Silicon (Si)7440-21-30.0185680.6900000.264399
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007664
Nickel (Ni)7440-02-00.0199130.7400000.283558
Palladium (Pd)7440-05-30.0018840.0700000.026823
subTotal2.691000100.00000038.318661
Mould CompoundFillerSilica -amorphous-7631-86-90.89424023.00000012.733586
Silica fused60676-86-02.33280060.00000033.218050
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1166403.0000001.660902
Ion trapping agentBismuth (Bi)7440-69-90.0194400.5000000.276817
PigmentCarbon black1333-86-40.0194400.5000000.276817
PolymerEpoxy resin systemProprietary0.2721607.0000003.875439
Phenolic resinProprietary0.2332806.0000003.321805
subTotal3.888000100.00000055.363416
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000105
Non hazardousProprietary0.0000910.0555000.001296
Tin solderTin (Sn)7440-31-50.16390299.9400002.333887
subTotal0.164000100.0000002.335288
WireImpurityNon hazardousProprietary0.0000020.0100000.000024
Pure metalGold (Au)7440-57-50.01672699.9900000.238176
subTotal0.016728100.0000000.238199
WireImpurityNon hazardousProprietary0.0000010.0100000.000021
Pure metalGold (Au)7440-57-50.01495999.9900000.213003
subTotal0.014960100.0000000.213024
total7.022688100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.