Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5230T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5230TSOT23TO-236AB7.914377 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405799121515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.110000100.0000001.389876
subTotal0.110000100.0000001.389876
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0024630.0900000.031124
Carbon (C)7440-44-00.0010950.0400000.013833
Chromium (Cr)7440-47-30.0060210.2200000.076082
Cobalt (Co)7440-48-40.0117690.4300000.148705
Iron (Fe)7439-89-61.31321347.98000016.592748
Manganese (Mn)7439-96-50.0235380.8600000.297411
Nickel (Ni)7440-02-00.98915236.14000012.498164
Phosphorus (P)7723-14-00.0005470.0200000.006917
Silicon (Si)7440-21-30.0071160.2600000.089915
Sulphur (S)7704-34-90.0005470.0200000.006917
Pure metal layerCopper (Cu)7440-50-80.31119711.3700003.932045
Silver (Ag)7440-22-40.0703412.5700000.888774
subTotal2.737000100.00000034.582634
Mould CompoundAdditiveNon hazardousProprietary0.1410852.9000001.782642
Triphenylphosphine603-35-00.0024320.0500000.030735
FillerSilica -amorphous-7631-86-93.50280072.00000044.258695
PigmentCarbon black1333-86-40.0024320.0500000.030735
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.72975015.0000009.220562
Phenol Formaldehyde resin (generic)9003-35-40.48650010.0000006.147041
subTotal4.865000100.00000061.470410
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000108
Non hazardousProprietary0.0001050.0555000.001332
Tin solderTin (Sn)7440-31-50.18988699.9400002.399254
subTotal0.190000100.0000002.400694
WireImpurityNon hazardousProprietary0.0000010.0100000.000016
Pure metalCopper (Cu)7440-50-80.01237699.9900000.156368
subTotal0.012377100.0000000.156384
total7.914377100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.