Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5250T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5250TSOT23TO-236AB8.254050 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405799221515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.440000100.0000005.330716
subTotal0.440000100.0000005.330716
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0024630.0900000.029844
Carbon (C)7440-44-00.0010950.0400000.013264
Chromium (Cr)7440-47-30.0060210.2200000.072951
Cobalt (Co)7440-48-40.0117690.4300000.142586
Iron (Fe)7439-89-61.31321347.98000015.909918
Manganese (Mn)7439-96-50.0235380.8600000.285172
Nickel (Ni)7440-02-00.98915236.14000011.983836
Phosphorus (P)7723-14-00.0005470.0200000.006632
Silicon (Si)7440-21-30.0071160.2600000.086215
Sulphur (S)7704-34-90.0005470.0200000.006632
Pure metal layerCopper (Cu)7440-50-80.31119711.3700003.770233
Silver (Ag)7440-22-40.0703412.5700000.852199
subTotal2.737000100.00000033.159479
Mould CompoundAdditiveNon hazardousProprietary0.1410852.9000001.709282
Triphenylphosphine603-35-00.0024320.0500000.029470
FillerSilica -amorphous-7631-86-93.50280072.00000042.437349
PigmentCarbon black1333-86-40.0024320.0500000.029470
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.72975015.0000008.841114
Phenol Formaldehyde resin (generic)9003-35-40.48650010.0000005.894076
subTotal4.865000100.00000058.940762
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000104
Non hazardousProprietary0.0001050.0555000.001278
Tin solderTin (Sn)7440-31-50.18988699.9400002.300519
subTotal0.190000100.0000002.301900
WireImpurityNon hazardousProprietary0.0000020.0100000.000027
Pure metalCopper (Cu)7440-50-80.02204899.9900000.267115
subTotal0.022050100.0000000.267142
total8.254050100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.