Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTC114YQC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC114YQC-QSOT8009DFN1412D-32.471772 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663504147212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.215230
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.029651
Phenolic resinProprietary0.00094713.5300000.038317
subTotal0.007000100.0000000.283198
DieDoped siliconSilicon (Si)7440-21-30.026000100.0000001.051877
subTotal0.026000100.0000001.051877
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920044.077733
Magnesium (Mg)7439-95-40.0016980.1454000.068707
Nickel (Ni)7440-02-00.0339762.9089001.374558
Silicon (Si)7440-21-30.0073620.6303000.297839
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017626
Nickel (Ni)7440-02-00.0335472.8722001.357216
Palladium (Pd)7440-05-30.0014800.1267000.059870
subTotal1.168000100.00000047.253549
Mould CompoundAdditiveNon hazardousProprietary0.0048460.4100000.196062
FillerSilica -amorphous-7631-86-90.0034280.2900000.138678
Silica fused60676-86-01.01829386.15000041.196882
HardenerPhenolic resinProprietary0.0507084.2900002.051476
PigmentCarbon black1333-86-40.0022460.1900000.090858
PolymerEpoxy resin systemProprietary0.1024798.6700004.145989
subTotal1.182000100.00000047.819945
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000151
Non hazardousProprietary0.0000460.0555000.001864
Tin solderTin (Sn)7440-31-50.08295099.9400003.355900
subTotal0.083000100.0000003.357915
WireImpurityNon hazardousProprietary0.0000010.0100000.000023
Pure metalCopper (Cu)7440-50-80.00577199.9900000.233493
subTotal0.005772100.0000000.233517
total2.471772100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.