Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTC144EMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC144EMBSOT883BXQFN30.710235 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065943315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.321021
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044225
Phenolic resinProprietary0.00040613.5300000.057150
subTotal0.003000100.0000000.422395
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000008.447908
subTotal0.060000100.0000008.447908
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.094617
Copper (Cu)7440-50-80.26320094.00000037.058157
Tin (Sn)7440-31-50.0006720.2400000.094617
Zinc (Zn)7440-66-60.0005880.2100000.082789
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031539
Nickel (Ni)7440-02-00.0138324.9400001.947524
Palladium (Pd)7440-05-30.0008120.2900000.114328
subTotal0.280000100.00000039.423571
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.010440
Silica fused60676-86-00.20400060.00000028.722887
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.436144
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.239357
PigmentCarbon black1333-86-40.0017000.5000000.239357
PolymerEpoxy resin systemProprietary0.0238007.0000003.351004
Phenolic resinProprietary0.0204006.0000002.872289
subTotal0.340000100.00000047.871479
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000127
Non hazardousProprietary0.0000110.0555000.001563
Tin solderTin (Sn)7440-31-50.01998899.9400002.814280
subTotal0.020000100.0000002.815969
WireImpurityNon hazardousProprietary0.0000010.0100000.000102
Pure metalGold (Au)7440-57-50.00723499.9900001.018519
subTotal0.007235100.0000001.018621
total0.710235100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.