Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD18VF1BBL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD18VF1BBLSOD882DFN1006-20.935958 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665743315112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.812002
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.111864
Phenolic resinProprietary0.00135313.5300000.144558
subTotal0.010000100.0000001.068424
DieDoped siliconSilicon (Si)7440-21-30.042000100.0000004.487381
subTotal0.042000100.0000004.487381
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.391708
Magnesium (Mg)7439-95-40.0008200.2000000.087611
Nickel (Ni)7440-02-00.0129153.1500001.379870
Silicon (Si)7440-21-30.0028290.6900000.302257
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013142
Nickel (Ni)7440-02-00.0052071.2700000.556328
Palladium (Pd)7440-05-30.0006970.1700000.074469
subTotal0.410000100.00000043.805384
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.058189
Silica fused60676-86-00.27000060.00000028.847448
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.442372
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.240395
PigmentCarbon black1333-86-40.0022500.5000000.240395
PolymerEpoxy resin systemProprietary0.0315007.0000003.365536
Phenolic resinProprietary0.0270006.0000002.884745
subTotal0.450000100.00000048.079080
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000096
Non hazardousProprietary0.0000110.0555000.001186
Tin solderTin (Sn)7440-31-50.01998899.9400002.135566
subTotal0.020000100.0000002.136848
WireImpurityNon hazardousProprietary0.0000000.0100000.000042
Pure metalGold (Au)7440-57-50.00395899.9900000.422893
subTotal0.003958100.0000000.422936
total0.935958100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.