Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2CANFD27U-QC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD27U-QCSOT8009DFN1412D-32.472880 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346617031472126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00456076.0000000.184400
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00062810.4700000.025404
Phenolic resinProprietary0.00081213.5300000.032828
subTotal0.006000100.0000000.242632
DieDoped siliconSilicon (Si)7440-21-30.049000100.0000001.981495
subTotal0.049000100.0000001.981495
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920044.057983
Magnesium (Mg)7439-95-40.0016980.1454000.068676
Nickel (Ni)7440-02-00.0339762.9089001.373943
Silicon (Si)7440-21-30.0073620.6303000.297706
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017618
Nickel (Ni)7440-02-00.0335472.8722001.356608
Palladium (Pd)7440-05-30.0014800.1267000.059843
subTotal1.168000100.00000047.232377
Mould CompoundAdditiveNon hazardousProprietary0.0047400.4100000.191663
FillerSilica -amorphous-7631-86-90.0033520.2900000.135567
Silica fused60676-86-00.99589486.15000040.272638
HardenerPhenolic resinProprietary0.0495924.2900002.005451
PigmentCarbon black1333-86-40.0021960.1900000.088820
PolymerEpoxy resin systemProprietary0.1002258.6700004.052975
subTotal1.156000100.00000046.747113
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000151
Non hazardousProprietary0.0000460.0555000.001863
Tin solderTin (Sn)7440-31-50.08295099.9400003.354396
subTotal0.083000100.0000003.356410
WireImpurityNon hazardousProprietary0.0000010.0100000.000044
Pure metalGold (Au)7440-57-50.01087999.9900000.439929
subTotal0.010880100.0000000.439973
total2.472880100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.