Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2CANFD36UQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD36UQB-QSOT8015DFN1110D-31.624523 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665544147412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.327481
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.045115
Phenolic resinProprietary0.00094713.5300000.058300
subTotal0.007000100.0000000.430896
DieDoped siliconSilicon (Si)7440-21-30.054000100.0000003.324053
subTotal0.054000100.0000003.324053
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600044.247248
Magnesium (Mg)7439-95-40.0011200.1490000.068973
Nickel (Ni)7440-02-00.0224162.9809001.379874
Silicon (Si)7440-21-30.0048570.6459000.298990
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003564
Nickel (Ni)7440-02-00.0044670.5940000.274966
Palladium (Pd)7440-05-30.0002740.0365000.016896
subTotal0.752000100.00000046.290511
Mould CompoundFillerSilica -amorphous-7631-86-90.0600107.9800003.693983
Silica fused60676-86-00.60229280.09200037.074996
PigmentCarbon black1333-86-40.0069790.9280000.429576
PolymerEpoxy resin systemProprietary0.0635448.4500003.911548
Phenolic resinProprietary0.0191762.5500001.180408
subTotal0.752000100.00000046.290511
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000158
Non hazardousProprietary0.0000320.0555000.001947
Tin solderTin (Sn)7440-31-50.05696699.9400003.506617
subTotal0.057000100.0000003.508722
WireImpurityNon hazardousProprietary0.0000000.0100000.000016
Pure metalCopper (Cu)7440-50-80.00252399.9900000.155316
subTotal0.002523100.0000000.155332
total1.624523100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.