Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2CANFD36UQC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD36UQC-QSOT8009DFN1412D-32.433723 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665545147312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01064076.0000000.437190
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00146610.4700000.060229
Phenolic resinProprietary0.00189413.5300000.077831
subTotal0.014000100.0000000.575250
DieDoped siliconSilicon (Si)7440-21-30.054000100.0000002.218823
subTotal0.054000100.0000002.218823
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920044.766847
Magnesium (Mg)7439-95-40.0016980.1454000.069781
Nickel (Ni)7440-02-00.0339762.9089001.396048
Silicon (Si)7440-21-30.0073620.6303000.302496
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017901
Nickel (Ni)7440-02-00.0335472.8722001.378435
Palladium (Pd)7440-05-30.0014800.1267000.060806
subTotal1.168000100.00000047.992315
Mould CompoundFillerSilica -amorphous-7631-86-90.0887387.9800003.646167
Silica fused60676-86-00.89062380.09200036.595087
PigmentCarbon black1333-86-40.0103190.9280000.424015
PolymerEpoxy resin systemProprietary0.0939648.4500003.860916
Phenolic resinProprietary0.0283562.5500001.165128
subTotal1.112000100.00000045.691313
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000153
Non hazardousProprietary0.0000460.0555000.001893
Tin solderTin (Sn)7440-31-50.08295099.9400003.408367
subTotal0.083000100.0000003.410413
WireImpurityNon hazardousProprietary0.0000000.0100000.000011
Pure metalCopper (Cu)7440-50-80.00272399.9900000.111883
subTotal0.002723100.0000000.111894
total2.433723100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.