Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD30VF1BBL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD30VF1BBLSOD882DFN1006-20.935965 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665742315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.811996
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.111863
Phenolic resinProprietary0.00135313.5300000.144557
subTotal0.010000100.0000001.068416
DieDoped siliconSilicon (Si)7440-21-30.042000100.0000004.487347
subTotal0.042000100.0000004.487347
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.391398
Magnesium (Mg)7439-95-40.0008200.2000000.087610
Nickel (Ni)7440-02-00.0129153.1500001.379859
Silicon (Si)7440-21-30.0028290.6900000.302255
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013142
Nickel (Ni)7440-02-00.0052071.2700000.556324
Palladium (Pd)7440-05-30.0006970.1700000.074469
subTotal0.410000100.00000043.805057
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.058106
Silica fused60676-86-00.27000060.00000028.847233
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.442362
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.240394
PigmentCarbon black1333-86-40.0022500.5000000.240394
PolymerEpoxy resin systemProprietary0.0315007.0000003.365510
Phenolic resinProprietary0.0270006.0000002.884723
subTotal0.450000100.00000048.078721
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000096
Non hazardousProprietary0.0000110.0555000.001186
Tin solderTin (Sn)7440-31-50.01998899.9400002.135550
subTotal0.020000100.0000002.136832
WireImpurityNon hazardousProprietary0.0000000.0100000.000042
Pure metalGold (Au)7440-57-50.00396599.9900000.423585
subTotal0.003965100.0000000.423627
total0.935965100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.