Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2020EPAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2020EPASSOT1061DHUSON37.676906 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340681491153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.146295
PolymerAcrylic resinProprietary0.02200020.0000000.286574
subTotal0.110000100.0000001.432869
DieDoped siliconSilicon (Si)7440-21-30.310000100.0000004.038085
subTotal0.310000100.0000004.038085
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.275183
Magnesium (Mg)7439-95-40.0140200.5000000.182626
Nickel (Ni)7440-02-00.1037483.7000001.351430
Silicon (Si)7440-21-30.0224320.8000000.292201
Pure metal layerGold (Au)7440-57-50.0016820.0600000.021915
Nickel (Ni)7440-02-00.0280401.0000000.365251
Palladium (Pd)7440-05-30.0028040.1000000.036525
subTotal2.804000100.00000036.525131
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.227514
FillerSilica -amorphous-7631-86-90.0123540.2900000.160924
Silica fused60676-86-03.66999086.15000047.805587
HardenerPhenolic resinProprietary0.1827544.2900002.380568
PigmentCarbon black1333-86-40.0080940.1900000.105433
PolymerEpoxy resin systemProprietary0.3693428.6700004.811079
subTotal4.260000100.00000055.491105
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000100
Non hazardousProprietary0.0000940.0555000.001229
Tin solderTin (Sn)7440-31-50.16989899.9400002.213105
subTotal0.170000100.0000002.214434
WireImpurityNon hazardousProprietary0.0000020.0100000.000030
Pure metalCopper (Cu)7440-50-80.02290399.9900000.298342
subTotal0.022906100.0000000.298372
total7.676906100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.