Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMN230ENE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMN230ENESOT457SC-7412.21403 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346602611154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.42869
PolymerResin systemProprietary0.0156423.000000.12805
subTotal0.06800100.000000.55674
DieDoped siliconSilicon (Si)7440-21-30.15000100.000001.22810
subTotal0.15000100.000001.22810
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700036.87887
Iron (Fe)7439-89-60.107442.270000.87964
Phosphorus (P)7723-14-00.003310.070000.02713
Zinc (Zn)7440-66-60.005680.120000.04650
Pure metal layerSilver (Ag)7440-22-40.112172.370000.91839
subTotal4.73300100.0000038.75053
Mould CompoundFillerSilica -amorphous-7631-86-92.3661735.0700019.37258
Silica fused60676-86-02.9578843.8400024.21711
PigmentCarbon black1333-86-40.016870.250000.13810
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6747010.000005.52398
Phenol Formaldehyde resin (generic)9003-35-40.670659.940005.49083
Polyethylene (PE) -wax-9002-88-40.060720.900000.49716
subTotal6.74700100.0000055.23976
Post-PlatingImpurityAntimony (Sb)7440-36-00.000050.010000.00040
Bismuth (Bi)7440-69-90.000100.020000.00080
Iron (Fe)7439-89-60.000050.010000.00040
Lead (Pb)7439-92-10.000050.010000.00040
Tin solderTin (Sn)7440-31-50.4857699.950003.97704
subTotal0.48600100.000003.97904
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0300299.990000.24580
subTotal0.03003100.000000.24582
total12.21403100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.