Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB10UP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB10UPSOT1220SOT12207.37247 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346610171158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00949
FillerSilver (Ag)7440-22-40.0588084.000000.79756
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09495
Isobornyl Methacrylate7534-94-30.003505.000000.04747
subTotal0.07000100.000000.94947
DieDoped siliconSilicon (Si)7440-21-30.47300100.000006.41576
subTotal0.47300100.000006.41576
Lead FrameCopper alloyCopper (Cu)7440-50-82.6865492.9600036.44022
Magnesium (Mg)7439-95-40.004050.140000.05488
Nickel (Ni)7440-02-00.083812.900001.13680
Silicon (Si)7440-21-30.018210.630000.24696
Pure metal layerGold (Au)7440-57-50.001440.050000.01960
Nickel (Ni)7440-02-00.087863.040001.19168
Palladium (Pd)7440-05-30.008090.280000.10976
subTotal2.89000100.0000039.19990
Mould CompoundAdditiveMisc. phosphorus compounds (generic) 0.003730.100000.05059
Non hazardousProprietary0.134283.600001.82137
FillerSilica fused60676-86-03.2824088.0000044.52239
PigmentCarbon black1333-86-40.007460.200000.10119
PolymerPhenolic resinProprietary0.152934.100002.07434
Tetramethylbiphenyl diglycidyl ether85954-11-60.149204.000002.02375
subTotal3.73000100.0000050.59363
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00023
Bismuth (Bi)7440-69-90.000030.020000.00046
Iron (Fe)7439-89-60.000020.010000.00023
Lead (Pb)7439-92-10.000020.010000.00023
Tin solderTin (Sn)7440-31-50.1699299.950002.30472
subTotal0.17000100.000002.30587
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0394799.990000.53533
subTotal0.03947100.000000.53538
total7.37247100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.