Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMZ350UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZ350UPESOT883XQFN30.875917 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068442315312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.867662
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.119532
Phenolic resinProprietary0.00135313.5300000.154467
subTotal0.010000100.0000001.141661
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.708303
subTotal0.050000100.0000005.708303
Lead FrameCopper alloyCopper (Cu)7440-50-80.40166393.41000045.856285
Magnesium (Mg)7439-95-40.0006280.1460000.071673
Nickel (Ni)7440-02-00.0125262.9130001.430033
Silicon (Si)7440-21-30.0027130.6310000.309767
MetallisationGold (Au)7440-57-50.0001500.0350000.017182
Nickel (Ni)7440-02-00.0118462.7550001.352468
Palladium (Pd)7440-05-30.0004730.1100000.054001
subTotal0.430000100.00000049.091409
Mould CompoundFillerSilica -amorphous-7631-86-90.08510023.0000009.715532
Silica fused60676-86-00.22200060.00000025.344867
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0111003.0000001.267243
Ion trapping agentBismuth (Bi)7440-69-90.0018500.5000000.211207
PigmentCarbon black1333-86-40.0018500.5000000.211207
PolymerEpoxy resin systemProprietary0.0259007.0000002.956901
Phenolic resinProprietary0.0222006.0000002.534487
subTotal0.370000100.00000042.241445
Post-PlatingImpurityLead (Pb)7439-92-10.0000000.0045000.000051
Non hazardousProprietary0.0000060.0555000.000634
Tin solderTin (Sn)7440-31-50.00999499.9400001.140976
subTotal0.010000100.0000001.141661
WireImpurityNon hazardousProprietary0.0000010.0100000.000068
Pure metalGold (Au)7440-57-50.00591699.9900000.675453
subTotal0.005917100.0000000.675521
total0.875917100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.