Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMZB350UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB350UPESOT883BXQFN30.698917 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066841315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.326219
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044941
Phenolic resinProprietary0.00040613.5300000.058076
subTotal0.003000100.0000000.429236
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000007.153925
subTotal0.050000100.0000007.153925
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.096149
Copper (Cu)7440-50-80.26320094.00000037.658263
Tin (Sn)7440-31-50.0006720.2400000.096149
Zinc (Zn)7440-66-60.0005880.2100000.084130
Pure metal layerGold (Au)7440-57-50.0002240.0800000.032050
Nickel (Ni)7440-02-00.0138324.9400001.979062
Palladium (Pd)7440-05-30.0008120.2900000.116180
subTotal0.280000100.00000040.061982
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.188739
Silica fused60676-86-00.20400060.00000029.188015
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.459401
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.243233
PigmentCarbon black1333-86-40.0017000.5000000.243233
PolymerEpoxy resin systemProprietary0.0238007.0000003.405268
Phenolic resinProprietary0.0204006.0000002.918802
subTotal0.340000100.00000048.646692
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000129
Non hazardousProprietary0.0000110.0555000.001588
Tin solderTin (Sn)7440-31-50.01998899.9400002.859853
subTotal0.020000100.0000002.861570
WireImpurityNon hazardousProprietary0.0000010.0100000.000085
Pure metalGold (Au)7440-57-50.00591699.9900000.846511
subTotal0.005917100.0000000.846596
total0.698917100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.