Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMZB950UPEL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB950UPELSOT883BXQFN30.635320 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340709113154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00304076.0000000.478499
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00041910.4700000.065920
Phenolic resinProprietary0.00054113.5300000.085185
subTotal0.004000100.0000000.629604
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000004.722030
subTotal0.030000100.0000004.722030
Lead FrameCopper alloyCopper (Cu)7440-50-80.24942291.03000039.259302
Magnesium (Mg)7439-95-40.0004660.1700000.073317
Nickel (Ni)7440-02-00.0077822.8400001.224832
Silicon (Si)7440-21-30.0016990.6200000.267393
Pure metal layerGold (Au)7440-57-50.0002190.0800000.034502
Nickel (Ni)7440-02-00.0136184.9700002.143455
Palladium (Pd)7440-05-30.0007950.2900000.125071
subTotal0.274000100.00000043.127873
Mould CompoundFillerSilica -amorphous-7631-86-90.06854023.00000010.788264
Silica fused60676-86-00.17880060.00000028.143298
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089403.0000001.407165
Ion trapping agentBismuth (Bi)7440-69-90.0014900.5000000.234527
PigmentCarbon black1333-86-40.0014900.5000000.234527
PolymerEpoxy resin systemProprietary0.0208607.0000003.283385
Phenolic resinProprietary0.0178806.0000002.814330
subTotal0.298000100.00000046.905496
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000156
Non hazardousProprietary0.0000120.0555000.001922
Tin solderTin (Sn)7440-31-50.02198799.9400003.460744
subTotal0.022000100.0000003.462822
WireImpurityNon hazardousProprietary0.0000010.0100000.000115
Pure metalGold (Au)7440-57-50.00731999.9900001.152060
subTotal0.007320100.0000001.152175
total0.635320100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.