Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN028-100HS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN028-100HSSOT1205LFPAK56D98.550000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346654671153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.600000100.0000003.652968
subTotal3.600000100.0000003.652968
ClipCopper alloyCopper (Cu)7440-50-813.17360099.80000013.367428
Iron (Fe)7439-89-60.0198000.1500000.020091
Phosphorus (P)7723-14-00.0066000.0500000.006697
subTotal13.200000100.00000013.394216
Lead FrameCopper alloyCopper (Cu)7440-50-835.32920099.80000035.849011
Iron (Fe)7439-89-60.0531000.1500000.053881
Phosphorus (P)7723-14-00.0177000.0500000.017960
subTotal35.400000100.00000035.920852
Mould CompoundAdditiveNon hazardousProprietary1.8908005.8000001.918620
FillerSilica -amorphous-7631-86-92.0538006.3000002.084018
Silica fused60676-86-023.47200072.00000023.817352
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.6520002.0000000.661593
PigmentCarbon black1333-86-40.0978000.3000000.099239
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.7172002.2000000.727752
Epoxy resin systemProprietary1.9560006.0000001.984779
Phenol Formaldehyde resin (generic)9003-35-41.7604005.4000001.786301
subTotal32.600000100.00000033.079655
Post-PlatingImpurityNon hazardousProprietary0.0001930.0100000.000196
Tin alloyTin (Sn)7440-31-51.92980799.9900001.958201
subTotal1.930000100.0000001.958397
Solder PasteLead alloyLead (Pb)7439-92-12.55300092.5000002.590563
Silver (Ag)7440-22-40.0690002.5000000.070015
Tin (Sn)7440-31-50.1380005.0000000.140030
subTotal2.760000100.0000002.800609
Solder PasteImpurityAntimony (Sb)7440-36-00.0027180.0300000.002758
Lead alloyLead (Pb)7439-92-18.37778292.4700008.501047
Silver (Ag)7440-22-40.2265002.5000000.229833
Tin (Sn)7440-31-50.4530005.0000000.459665
subTotal9.060000100.0000009.193303
total98.550000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.