Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN1R1-50SLH

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN1R1-50SLHSOT1235LFPAK88337.86000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346613011181126030 s124020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.81000100.000000.83171
subTotal2.81000100.000000.83171
ClipCopper alloyCopper (Cu)7440-50-847.1339299.8600013.95073
Iron (Fe)7439-89-60.051920.110000.01537
Phosphorus (P)7723-14-00.014160.030000.00419
subTotal47.20000100.0000013.97029
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600051.18320
Iron (Fe)7439-89-60.225120.130000.06663
Phosphorus (P)7723-14-00.051950.030000.01538
subTotal173.17000100.0000051.26521
Mould CompoundFillerSilica fused60676-86-063.3330062.0000018.74534
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.68633
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.06047
PigmentCarbon black1333-86-40.510750.500000.15117
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.32579
Phenolic resinProprietary8.989208.800002.66063
Tetramethylbiphenyl diglycidyl ether85954-11-62.043002.000000.60469
subTotal102.15000100.0000030.23442
Post-PlatingPure metalTin (Sn)7440-31-54.88000100.000001.44439
subTotal4.88000100.000001.44439
Solder PasteLead alloyLead (Pb)7439-92-14.9580092.500001.46747
Silver (Ag)7440-22-40.134002.500000.03966
Tin (Sn)7440-31-50.268005.000000.07932
subTotal5.36000100.000001.58645
Solder PasteImpurityAntimony (Sb)7440-36-00.000920.040000.00027
Lead alloyLead (Pb)7439-92-12.1175692.470000.62676
Silver alloySilver (Ag)7440-22-40.057252.500000.01694
Tin alloyTin (Sn)7440-31-50.114505.000000.03389
subTotal2.29000100.000000.67786
total337.86000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.