Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN2R0-55YLH

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN2R0-55YLHSOT1023LFPAK56E115.420000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346613041153126030 s124020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.770000100.0000001.533530
subTotal1.770000100.0000001.533530
ClipCopper alloyCopper (Cu)7440-50-827.34520099.80000023.691908
Iron (Fe)7439-89-60.0411000.1500000.035609
Phosphorus (P)7723-14-00.0137000.0500000.011870
subTotal27.400000100.00000023.739387
Lead FrameCopper alloyCopper (Cu)7440-50-840.34748099.87000034.957096
Iron (Fe)7439-89-60.0404000.1000000.035003
Phosphorus (P)7723-14-00.0121200.0300000.010501
subTotal40.400000100.00000035.002599
Mould CompoundFillerSilica fused60676-86-018.81080062.00000016.297695
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-24.70270015.5000004.074424
ImpuritySilicon Dioxide (SiO2)14808-60-70.0606800.2000000.052573
PigmentCarbon black1333-86-40.1517000.5000000.131433
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6068002.0000000.525732
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.33740011.0000002.891527
Phenolic resinProprietary2.6699208.8000002.313221
subTotal30.340000100.00000026.286605
Post-PlatingImpurityNon hazardousProprietary0.0001730.0100000.000150
Tin alloyTin (Sn)7440-31-51.72982799.9900001.498724
subTotal1.730000100.0000001.498874
Solder PasteLead alloyLead (Pb)7439-92-13.82950092.5000003.317883
Silver (Ag)7440-22-40.1035002.5000000.089673
Tin (Sn)7440-31-50.2070005.0000000.179345
subTotal4.140000100.0000003.586900
Solder PasteImpurityAntimony (Sb)7440-36-00.0028920.0300000.002506
Lead alloyLead (Pb)7439-92-18.91410892.4700007.723192
Silver (Ag)7440-22-40.2410002.5000000.208803
Tin (Sn)7440-31-50.4820005.0000000.417605
subTotal9.640000100.0000008.352105
total115.420000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.