Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN3R5-40YSD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN3R5-40YSDSOT669LFPAK77.730000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346607361152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.900000100.0000002.444359
subTotal1.900000100.0000002.444359
ClipCopper alloyCopper (Cu)7440-50-84.99338199.8676206.424007
Iron (Fe)7439-89-60.0049960.0999100.006427
Phosphorus (P)7723-14-00.0016240.0324700.002089
subTotal5.000000100.0000006.432523
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000048.678723
Iron (Fe)7439-89-60.0568650.1500000.073157
Phosphorus (P)7723-14-00.0151640.0400000.019509
subTotal37.910000100.00000048.771388
Mould CompoundFillerSilica fused60676-86-013.96860062.00000017.970668
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-23.49215015.5000004.492667
ImpuritySilicon Dioxide (SiO2)14808-60-70.0450600.2000000.057970
PigmentCarbon black1333-86-40.1126500.5000000.144925
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4506002.0000000.579699
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.47830011.0000003.188344
Phenolic resinProprietary1.9826408.8000002.550675
subTotal22.530000100.00000028.984948
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000495
Tin alloyTin (Sn)7440-31-53.84961599.9900004.952547
subTotal3.850000100.0000004.953043
Solder PasteLead alloyLead (Pb)7439-92-16.04950092.5000007.782709
Silver (Ag)7440-22-40.1635002.5000000.210343
Tin (Sn)7440-31-50.3270005.0000000.420687
subTotal6.540000100.0000008.413740
total77.730000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.