Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMNR98-25YLE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMNR98-25YLESOT669LFPAK103.310000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346641101152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.970000100.0000000.938922
subTotal0.970000100.0000000.938922
ClipCopper alloyCopper (Cu)7440-50-827.34520099.80000026.469074
Iron (Fe)7439-89-60.0411000.1500000.039783
Phosphorus (P)7723-14-00.0137000.0500000.013261
subTotal27.400000100.00000026.522118
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000036.625662
Iron (Fe)7439-89-60.0568650.1500000.055043
Phosphorus (P)7723-14-00.0151640.0400000.014678
subTotal37.910000100.00000036.695383
Mould CompoundFillerSilica fused60676-86-013.96860062.00000013.521053
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-23.49215015.5000003.380263
ImpuritySilicon Dioxide (SiO2)14808-60-70.0450600.2000000.043616
PigmentCarbon black1333-86-40.1126500.5000000.109041
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4506002.0000000.436163
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.47830011.0000002.398897
Phenolic resinProprietary1.9826408.8000001.919117
subTotal22.530000100.00000021.808150
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000373
Tin alloyTin (Sn)7440-31-53.84961599.9900003.726275
subTotal3.850000100.0000003.726648
Solder PasteLead alloyLead (Pb)7439-92-13.52425092.5000003.411335
Silver (Ag)7440-22-40.0952502.5000000.092198
Tin (Sn)7440-31-50.1905005.0000000.184396
subTotal3.810000100.0000003.687930
Solder PasteImpurityAntimony (Sb)7440-36-00.0020520.0300000.001986
Lead alloyLead (Pb)7439-92-16.32494892.4700006.122300
Silver (Ag)7440-22-40.1710002.5000000.165521
Tin (Sn)7440-31-50.3420005.0000000.331042
subTotal6.840000100.0000006.620850
total103.310000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.