Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PTVS6V5P1UP-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934665614115PTVS6V5P1UP-QXPTVS6V5P1UP-QSOD128 (FlatPower)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 68175 ppm of the article. SCIP No. e69b8273-820f-4c43-8ec6-8b54a5b7d316.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1001 ppm; substance 7439-92-1: 68175 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1001 ppm; substance 7439-92-1: 68175 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 6895 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-31.080000100.0000003.183962
Die Total1.080000100.0000003.183962
ClipCopper alloyCopper (Cu)7440-50-86.84109599.87000020.168322
ClipCopper alloyIron (Fe)7439-89-60.0068500.1000000.020195
ClipCopper alloyPhosphorus (P)7723-14-00.0020550.0300000.006058
Clip Total6.850000100.00000020.194575
Lead FrameCopper alloyCopper (Cu)7440-50-811.63324498.42000034.296120
Lead FrameCopper alloyIron (Fe)7439-89-60.0118200.1000000.034847
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0035460.0300000.010454
Lead FramePure metal layerSilver (Ag)7440-22-40.1713901.4500000.505277
Lead Frame Total11.820000100.00000034.846698
Mould CompoundFillerSilica fused60676-86-08.03720071.00000023.694576
Mould CompoundPolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.23004019.7000006.574410
Mould CompoundPolymerPhenolic resin1.0188009.0000003.003538
Mould CompoundPigmentCarbon black1333-86-40.0339600.3000000.100118
Mould Compound Total11.320000100.00000033.372642
Post-PlatingTin solderTin (Sn)7440-31-50.34996699.9900001.031736
Post-PlatingImpurityLead (Pb)7439-92-10.0000180.0050000.000053
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000100.0030000.000031
Post-PlatingImpurityCopper (Cu)7440-50-80.0000030.0010000.000010
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000030.0010000.000010
Post-Plating Total0.350000100.0000001.031840
Solder PasteLead alloyLead (Pb)7439-92-12.31250092.5000006.817512
Solder PasteLead alloyTin (Sn)7440-31-50.1250005.0000000.368514
Solder PasteLead alloySilver (Ag)7440-22-40.0625002.5000000.184257
Solder Paste Total2.500000100.0000007.370283
PTVS6V5P1UP-Q Total33.920000100.000000100.000000
Notes
Report created on 2024-10-15 22:04:42 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-15 22:04:42 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material		 有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
半导体芯片 (Die)◯◯◯◯◯◯
夹子 (Clip)◯◯◯◯◯◯
引线框架 (Lead Frame)◯◯◯◯◯◯
模封料 (Mould Compound)◯◯◯◯◯◯
后镀层 (Post-Plating)◯◯◯◯◯◯
锡膏 (Solder Paste)✕◯◯◯◯◯
◯ 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕ 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限（EFUP）。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-15 22:04:42 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.