Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content RB751CS40

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
RB751CS40SOD882DFN1006-20.933477 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406130431513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.814160
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.112161
Phenolic resinProprietary0.00135313.5300000.144942
subTotal0.010000100.0000001.071264
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000004.285055
subTotal0.040000100.0000004.285055
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.501719
Magnesium (Mg)7439-95-40.0008200.2000000.087844
Nickel (Ni)7440-02-00.0129153.1500001.383537
Silicon (Si)7440-21-30.0028290.6900000.303060
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013177
Nickel (Ni)7440-02-00.0052071.2700000.557807
Palladium (Pd)7440-05-30.0006970.1700000.074667
subTotal0.410000100.00000043.921811
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.087579
Silica fused60676-86-00.27000060.00000028.924119
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.446206
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.241034
PigmentCarbon black1333-86-40.0022500.5000000.241034
PolymerEpoxy resin systemProprietary0.0315007.0000003.374481
Phenolic resinProprietary0.0270006.0000002.892412
subTotal0.450000100.00000048.206865
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000096
Non hazardousProprietary0.0000110.0555000.001189
Tin solderTin (Sn)7440-31-50.01998899.9400002.141242
subTotal0.020000100.0000002.142527
WireImpurityNon hazardousProprietary0.0000000.0100000.000037
Pure metalGold (Au)7440-57-50.00347799.9900000.372441
subTotal0.003477100.0000000.372478
total0.933477100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.