Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content XC7WT14GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
XC7WT14GTSOT833-1XSON82.60719 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352943761155126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.09916100.000003.80340
subTotal0.09916100.000003.80340
ComponentAdditiveNon hazardousProprietary0.001005.000000.03836
FillerAluminium Trioxide (Al2O3)1344-28-10.0080040.000000.30684
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0030015.000000.11507
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0020010.000000.07671
Resin systemProprietary0.0060030.000000.23013
subTotal0.02000100.000000.76711
Lead FrameCopper alloyCopper (Cu)7440-50-80.9883692.3700037.90897
Magnesium (Mg)7439-95-40.001500.140000.05746
Nickel (Ni)7440-02-00.030822.880001.18196
Silicon (Si)7440-21-30.006630.620000.25445
Pure metal layerGold (Au)7440-57-50.000430.040000.01642
Nickel (Ni)7440-02-00.040553.790001.55543
Palladium (Pd)7440-05-30.001710.160000.06566
subTotal1.07000100.0000041.04035
Mould CompoundFillerSilica -amorphous-7631-86-90.2720020.0000010.43269
Silica fused60676-86-00.8772064.5000033.64542
Flame retardantMetal hydroxideProprietary0.040803.000001.56490
ImpuritySilicon Dioxide (SiO2)14808-60-70.006800.500000.26082
PigmentCarbon black1333-86-40.004080.300000.15649
PolymerPhenol Formaldehyde resin (generic)9003-35-40.029922.200001.14760
Phenolic resinProprietary0.034002.500001.30409
Tetramethylbiphenyl diglycidyl ether85954-11-60.095207.000003.65144
subTotal1.36000100.0000052.16345
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000000.005000.00004
Tin solderTin (Sn)7440-31-50.0200099.990000.76703
subTotal0.02000100.000000.76711
WireGold alloyGold (Au)7440-57-50.0376499.000001.44388
Palladium (Pd)7440-05-30.000381.000000.01458
subTotal0.03802100.000001.45846
total2.60719100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.