Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 1PS88SB82

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
1PS88SB82SOT363SC-885.45211 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405658016514126030 s123520 s3
93405658011516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.10049
subTotal0.06000100.000001.10049
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002070.100000.03797
Carbon (C)7440-44-00.001040.050000.01898
Chromium (Cr)7440-47-30.005180.250000.09492
Cobalt (Co)7440-48-40.010350.500000.18983
Iron (Fe)7439-89-61.1426455.2000020.95776
Manganese (Mn)7439-96-50.020701.000000.37967
Misc. Sulfur compounds (generic)7704-34-90.000620.030000.01139
Misc. phosphorus compounds (generic) 0.000620.030000.01139
Nickel (Ni)7440-02-00.8607141.5800015.78666
Silicon (Si)7440-21-30.006210.300000.11390
Pure metal layerCopper (Cu)7440-50-80.017390.840000.31892
Silver (Ag)7440-22-40.002480.120000.04556
subTotal2.07000100.0000037.96695
Mould CompoundFillerSilica fused60676-86-02.0874071.0000038.28609
PigmentCarbon black1333-86-40.008820.300000.16177
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5791819.7000010.62304
Phenolic resinProprietary0.264609.000004.85317
subTotal2.94000100.0000053.92407
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.78568
subTotal0.37000100.000006.78636
WirePure metalGold (Au)7440-57-50.01211100.000000.22212
subTotal0.01211100.000000.22212
total5.45211100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.