Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT164BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT164BQ-Q100SOT762-1DHVQFN1418.265346 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013791155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001273
FillerSilver (Ag)7440-22-40.01744575.0000000.095509
PolymerAcrylic resinProprietary0.0013966.0000000.007641
Resin systemProprietary0.00418718.0000000.022922
subTotal0.023260100.0000000.127345
DieDoped siliconSilicon (Si)7440-21-30.292322100.0000001.600418
subTotal0.292322100.0000001.600418
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000036.926262
Iron (Fe)7439-89-60.1660752.4000000.909234
Phosphorus (P)7723-14-00.0020760.0300000.011365
Zinc (Zn)7440-66-60.0069200.1000000.037885
subTotal6.919780100.00000037.884746
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.718649
FillerSilica -amorphous-7631-86-90.3671483.4900002.010082
Silica fused60676-86-08.92307284.82000048.852469
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.577107
PigmentCarbon black1333-86-40.0172530.1640000.094457
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.131608
Epoxy resin systemProprietary0.1668471.5860000.913464
Phenolic resinProprietary0.2370162.2530001.297626
subTotal10.520010100.00000057.595460
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.075783
Nickel (Ni)7440-02-00.42587292.3000002.331586
Palladium (Pd)7440-05-30.0143033.1000000.078309
Silver (Ag)7440-22-40.0073821.6000000.040418
subTotal0.461400100.0000002.526095
WirePure metalCopper (Cu)7440-50-80.04689996.5500000.256763
Pure metal layerGold (Au)7440-57-50.0001700.3500000.000931
Palladium (Pd)7440-05-30.0015063.1000000.008244
subTotal0.048574100.0000000.265937
total18.265346100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.