Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G241GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G241GFSOT1089XSON81.77195 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352915061155126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08956100.000005.05428
subTotal0.08956100.000005.05428
ComponentAdditiveNon hazardousProprietary0.001005.000000.05644
FillerAluminium Trioxide (Al2O3)1344-28-10.0080040.000000.45148
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0030015.000000.16931
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0020010.000000.11287
Resin systemProprietary0.0060030.000000.33861
subTotal0.02000100.000001.12871
Lead FrameCopper alloyCopper (Cu)7440-50-80.6372495.1100035.96247
Magnesium (Mg)7439-95-40.001340.200000.07562
Nickel (Ni)7440-02-00.021243.170001.19862
Silicon (Si)7440-21-30.004620.690000.26090
Pure metal layerGold (Au)7440-57-50.000130.020000.00756
Nickel (Ni)7440-02-00.004960.740000.27980
Palladium (Pd)7440-05-30.000470.070000.02647
subTotal0.67000100.0000037.81144
Mould CompoundFillerSilica -amorphous-7631-86-90.1880020.0000010.60978
Silica fused60676-86-00.6063064.5000034.21654
Flame retardantMetal hydroxideProprietary0.028203.000001.59147
ImpuritySilicon Dioxide (SiO2)14808-60-70.004700.500000.26524
PigmentCarbon black1333-86-40.002820.300000.15915
PolymerPhenol Formaldehyde resin (generic)9003-35-40.020682.200001.16708
Phenolic resinProprietary0.023502.500001.32622
Tetramethylbiphenyl diglycidyl ether85954-11-60.065807.000003.71342
subTotal0.94000100.0000053.04890
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.69288
subTotal0.03000100.000001.69305
WireGold alloyGold (Au)7440-57-50.0221699.000001.25080
Palladium (Pd)7440-05-30.000221.000000.01263
subTotal0.02239100.000001.26343
total1.77195100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.