Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAW56

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAW56SOT23TO-236AB7.680040 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93309899023517126030 s123520 s3
93309899021516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000000.781246
subTotal0.060000100.0000000.781246
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029871
Carbon (C)7440-44-00.0010200.0400000.013276
Chromium (Cr)7440-47-30.0056080.2200000.073018
Cobalt (Co)7440-48-40.0109610.4300000.142717
Iron (Fe)7439-89-61.22301047.98000015.924529
Manganese (Mn)7439-96-50.0219210.8600000.285433
Nickel (Ni)7440-02-00.92120936.14000011.994841
Phosphorus (P)7723-14-00.0005100.0200000.006638
Silicon (Si)7440-21-30.0066270.2600000.086294
Sulphur (S)7704-34-90.0005100.0200000.006638
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.773695
Silver (Ag)7440-22-40.0655092.5700000.852981
subTotal2.549000100.00000033.189931
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.842321
Triphenylphosphine603-35-00.0024400.0500000.031764
FillerSilica -amorphous-7631-86-93.51288072.00000045.740387
PigmentCarbon black1333-86-40.0024400.0500000.031764
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.529247
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.352831
subTotal4.879000100.00000063.528315
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000108
Non hazardousProprietary0.0001030.0555000.001337
Tin solderTin (Sn)7440-31-50.18488999.9400002.407396
subTotal0.185000100.0000002.408842
WirePure metalCopper (Cu)7440-50-80.007040100.0000000.091669
subTotal0.007040100.0000000.091669
total7.680040100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.