Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC817DS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC817DS-QSOT457SC-7410.952174 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346659171151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.160000100.0000001.460897
subTotal0.160000100.0000001.460897
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0031920.0800000.029145
Carbon (C)7440-44-00.0015960.0400000.014572
Chromium (Cr)7440-47-30.0083790.2100000.076505
Cobalt (Co)7440-48-40.0167580.4200000.153011
Iron (Fe)7439-89-61.88407847.22000017.202776
Manganese (Mn)7439-96-50.0339150.8500000.309665
Nickel (Ni)7440-02-01.41924335.57000012.958551
Phosphorus (P)7723-14-00.0007980.0200000.007286
Silicon (Si)7440-21-30.0099750.2500000.091078
Sulphur (S)7704-34-90.0007980.0200000.007286
Pure metal layerCopper (Cu)7440-50-80.52109413.0600004.757905
Silver (Ag)7440-22-40.0901742.2600000.823343
subTotal3.990000100.00000036.431123
Mould CompoundFillerSilica fused60676-86-04.44120371.00000040.550884
PigmentCarbon black1333-86-40.0187660.3000000.171342
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.23227819.70000011.251442
Phenolic resinProprietary0.5629699.0000005.140253
subTotal6.255216100.00000057.113921
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000160.0030000.000143
Bismuth (Bi)7440-69-90.0000050.0010000.000048
Copper (Cu)7440-50-80.0000050.0010000.000048
Lead (Pb)7439-92-10.0000260.0050000.000238
Tin solderTin (Sn)7440-31-50.52121699.9900004.759017
subTotal0.521268100.0000004.759493
WirePure metalGold (Au)7440-57-50.025690100.0000000.234565
subTotal0.025690100.0000000.234565
total10.952174100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.